Surface Mount Technology (SMT)
SMT is a modern PCB assembly method where components are placed directly onto the surface of PCBs
using automated machines for high precision and speed.
SMT Capabilities
- Stencil solder paste printing with SPI inspection
- High-speed, high-precision SMT pick-and-place machines supporting fine-pitch components
- Capable of handling 0201, 0402, and micro-BGA/QFN packages
- Reflow ovens with multiple temperature zones ensuring precise thermal profiling
- Automated Optical Inspection (AOI) for quality assurance
- Lead-free (RoHS) and lead-based solder process compatibility
Assembly Process
Solder Paste Printing
Pick and Place
Reflow Soldering
Inspection & Quality Check
Through-Hole Technology
Traditional PCB assembly technique where component leads are inserted through drilled holes and
soldered solidly to the PCB for mechanical strength.
Through-Hole Capabilities
- Manual and automated component insertion
- Support for a wide range of through-hole components, including:
- i.e., connectors, transformers, relays, capacitors, inductors, and pin headers
- Precise lead forming, trimming, and clinching operations
- Wave and selective soldering processes
- Suitable for components requiring high mechanical stability
- Inspection and functional testing
Assembly Process
Component Insertion
Wave/Selective Soldering
Inspection & Cleaning
Mixed Technology
Combines SMT and Through-Hole assembly techniques in a single PCB to accommodate diverse components
and complex designs.
Mixed Technology Capabilities
- Fully integrated SMT and Through-Hole (THT) assembly under one roof
- Support for single-sided and double-sided mixed assemblies
- Optimized production flow combining reflow soldering, wave soldering, and selective soldering
- Capability to handle prototype, low-volume, and high-volume production
- Comprehensive Quality Control checks
Assembly Process
Solder Paste Printing (SMT)
Pick and Place & Reflow (SMT)
Through-Hole Component Insertion
Wave Soldering
Inspection & Testing
BGA (Ball Grid Array)
Specialized assembly process for densely packed BGAs requiring precise solder ball placement, reflow,
and X-ray inspection.
BGA Assembly Capabilities
- Precise solder ball placement
- Controlled reflow ovens with nitrogen atmosphere
- X-ray inspection for hidden solder joints
- High reliability and low failure rates
Assembly Process
Solder Paste/ Ball Placement
Reflow Soldering
X-Ray Inspection
Functional Testing
User Case
Use Case: Industrial Motor Controller Unit
Industry: Industrial Automation / Motor Control Systems
Objective: Deliver a fully assembled, production-ready motor controller PCB with high thermal reliability and precision soldering.